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  1 low power ambient light and proximity sensor with internal ir-led and digital output ISL29043 the ISL29043 is an integrated ambient and infrared light-to-digital converter with a built-in ir led and i 2 c interface (smbus compatible). this device uses two independent adcs for concurrently measuring ambient light and proximity in parallel. the flexible interrupt scheme is designed for minimal microcontroller utilization. for ambient light sensor (als) data conversions, an adc converts photodiode current (with a light sensitivity range up to 2000 lux) in 100ms per sample . the adc rejects 50hz/60hz flicker noise caused by artificial light sources. for proximity sensor (prox) data conversions, the built-in driver turns on an internal infrared led and the proximity sensor adc converts the reflected ir intensit y to digital. this adc rejects ambient ir noise (such as sunlight) and has a 540 s conversion time. the ISL29043 provides low power operation of als and proximity sensing with a typical 136 a normal operation current (110 a for sensors and internal circuitry, ~28 a for led) with 220ma current pulses for a net 100 s, repeating every 800ms (or under). the ISL29043 uses both a hardware pin and software bits to indicate an interrupt event has occurred. an als interrupt is defined as a measurement that is outside a set window. a proximity interrupt is defined as a measurement over a threshold limit. the user may al so require that both als/prox interrupts occur at once, up to 16 times in a row before activating the interrupt pin. the ISL29043 is designed to operate from 2.25v to 3.63v over the -40c to +85c ambient temperature range. it is packaged in a clear, lead-free 10 ld odfn package. features ? internal led + sensor = complete solution ? works under all light sources including sunlight ? dual adcs measure als/prox concurrently ?<1.0 a supply current when powered down ? temperature compensated ? pb-free (rohs compliant) intelligent and flexible interrupts ? independent als/prox interrupt thresholds ? adjustable interrupt persistency - 1/4/8/16 consecutive triggers required before interrupt applications ? display and keypad dimming adjustment and proximity sensing for: - mobile devices: smart phone, pda, gps - computing devices: laptop pc, netbook, tablet pc - consumer devices: lcd-tv, digital picture frame, digital camera - industrial and medical light and proximity sensing related literature ? see an1436 , ?proximity sensors? figure 1. typical application diagram figure 2. proximity response vs distance addr0 2 gnd 4 rext 5 sda int 8 irdr 9 ISL29043 r1 10k ? r2 10k ? r ext 499k ? v dd controller int sda slave_0 slave_1 i 2 c slave_n i 2 c master scl sda scl sda v i2c pull-up 7 r3 10k ? scl 3 v dd 6 c3 0.1f scl c2 1f 10 1 led+ led- v led c1 1.0f 0 51 102 153 204 255 0 25 50 75 100 125 150 distance (mm) prox counts (8-bit) 220ma (18% grey card) 110ma (18% grey card) 110ma (white copy paper) 220ma (white copy paper) february 9, 2012 fn7935.0 caution: these devices are sensitive to electrostatic discharge; follow proper ic handling procedures. 1-888-intersil or 1-888-468-3774 | copyright intersil americas inc. 2012. all rights reserved intersil (and design) is a trademark owned by intersil corporation or one of its subsidiaries. all other trademarks mentioned are the property of their respective owners. www.datasheet.net/ datasheet pdf - http://www..co.kr/
ISL29043 2 fn7935.0 february 9, 2012 ISL29043 block diagram pin configuration ISL29043 (10 ld 2.1x3.5 (mm) optical co-package) top view vdd rext gnd scl ir photodiode light data 5 4 6 3 fosc iref irdr array als photodiode process als and ir array dual channel adcs 9 int 8 command register data register i 2 c ir driver interrupt sda 7 addr0 2 led+ 1 led- 10 1 8 7 6 5 4 3 2 10 9 led+ scl sda irdr led- rext gnd vdd addr0 int *thermal pad must be left floating pin descriptions pin # pin name description 0 t-pad thermal pad. floating - do not connect to gnd or vdd 1 led+ anode of ir-led 2addr0i 2 c address pin - pull high or low (do not float) 3 vdd positive supply: 2.25v to 3.63v 4gndground 5 rext external resistor (499k ; 1%) connects this pin to ground. 6scli 2 c clock line the i 2 c bus lines can be pulled from 1.7v to above v dd , 3.63v max. 7sdai 2 c data line 8int interrupt pin; logic output (open-drain) for interrupt 9 irdr ir-led driver pin - current flows into ISL29043 from led cathode 10 led- cathode of ir-led ordering information part number (notes 1, 2, 3) temp. range (c) package tape & reel (pb-free) pkg. dwg. # ISL29043iromz-t7 -40 to +85 10 ld optical co-package l10.2.1x3.5e ISL29043iromz-evalz evaluation board notes: 1. please refer to tb347 for details on reel specifications. 2. these intersil pb-free plastic packaged products employ spec ial pb-free material sets: molding compounds, die attach material s, nipdau plate (e4 termination finish), which are all rohs co mpliant. the ISL29043 is compatible with lim ited snpb and pb-free soldering operation s. the ISL29043 is msl classified. see tech brief tb489 ( surface mount guidelines for optical co-packages) for reflow profile and more information. 3. for moisture sensitivity level (msl), please see device information page for ISL29043 . for more information on msl please see tech brief tb477 . www.datasheet.net/ datasheet pdf - http://www..co.kr/
ISL29043 3 fn7935.0 february 9, 2012 absolute maximum ratings (t a = +25c) thermal information v dd supply voltage between v dd and gnd . . . . . . . . . . . . . . . . . . . . . .4.0v i 2 c bus pin voltage (scl, sda). . . . . . . . . . . . . . . . . . . . . . . . . -0.5v to 4.0v i 2 c bus pin current (scl, sda). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <10ma r ext pin voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5v to vdd + 0.5v irdr pin voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5.5v addr0 pin voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5v to vdd + 0.5v int pin voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5v to 4.0v int pin current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <10ma esd rating human body model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (note 6) 2kv thermal resistance (typical) ja (c/w) jc (c/w) 10 ld optical module package (notes 4, 5) 113 58 maximum die temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +90c storage temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40c to +85c operating temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40c to +85c pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see tb489 http://www.intersil.com/ pbfree/pb-freereflow.asp caution: do not operate at or near the maximum ratings listed for extended periods of time. exposure to such conditions may adv ersely impact product reliability and result in failures not covered by warranty. notes: 4. ja is measured with the component mounted on a high effective thermal conductivity test board in free air. see tech brief tb379 for details. 5. for jc , the ?case temp? location is the center of the exposed metal pad on the package underside. 6. esd is rated at 2kv hbm on all pins except irdr, which is rated at 1kv. important note: all parameters having min/max specifications are guaranteed. typical values are for information purposes only. u nless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: t j = t c = t a electrical specifications v dd = 3.0v, t a = +25c, r ext = 499k ? 1% tolerance. parameter description condition min (note 7) typ max (note 7) unit v dd power supply range 2.25 3.0 3.63 v sr_v dd input power-up slew rate v dd rising edge between 0.4v and 2.25v 0.5 v/ms i dd_off supply current when powered down als_en = 0; prox_en = 0 0.1 0.8 a i dd_norm supply current for als+prox in sleep time als_en = 1; prox_en = 1 110 125 a i dd_prx_slp supply current for prox in sleep time als_en = 0; prox_en = 1 80 a i dd_als supply current for als als_en = 1; prox_en = 0 96 a f osc internal oscillator frequency 5.25 mhz t intgr_als 12-bit als integration/conversion time 88 100 112 ms t intgr_prox 8-bit prox integration/conversion time 0.54 ms data als_0 als result when dark e ambient = 0 lux, 2k range 1 3 counts data als_f full scale als adc code e ambient > selected range maximum lux (note 10) 4095 counts data data count output variation over three light sources: fluorescent, incandescent and sunlight ambient light sensing 10 % data als_1 light count output with lsb of 0.029 lux/count e = 47 lux, green led (note 10), als_range = 0 1638 counts data als_2 light count output with lsb of 0.469 lux/count e = 288 lux, green led, als_range = 1 460 614 768 counts data prox_0 prox measurement ir led off (note 8) 1 3 counts data prox_f full scale prox adc code 255 counts t r rise time for irdr sink current r load = 15 at irdr pin, 20% to 80% 500 ns t f fall time for ir dr sink current r load = 15 at irdr pin, 80% to 20% 500 ns i irdr_0 irdr sink current prox_dr = 0; v irdr = 0.5v 90 110 130 ma i irdr_1 irdr sink current prox_dr = 1; v irdr = 0.5v 220 ma i irdr_leak irdr leakage current prox_en = 0; v dd = 3.63v (note 9) 0.001 1 a v irdr acceptable voltage range on irdr pin register bit prox_dr = 0 0.5 4.3 v www.datasheet.net/ datasheet pdf - http://www..co.kr/
ISL29043 4 fn7935.0 february 9, 2012 t pulse net i irdr on time per prox reading 100 s v ref voltage of r ext pin 0.52 v f i 2 c i 2 c clock rate range 400 khz v i 2 c supply voltage range for i 2 c interface 1.7 3.63 v v il scl and sda input low voltage 0.55 v v ih scl and sda input high voltage 1.25 v i sda sda current sinking capability v ol = 0.4v 3 5 ma i int int current sinking capability v ol = 0.4v 3 5 ma psrr irdr ( i irdr )/( v irdr ) prox_dr = 0; v irdr = 0.5v to 4.3v 3 ma/v notes: 7. compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design. 8. an 850nm infrared led is used to test pr ox/ir sensitivity in an internal test mode. 9. ability to guarantee i irdr leakage of ~1na is limited by test hardware. 10. for als applications under light-distorting glass, please see the section titled ?als range 1 considerations? on page 10 . electrical specifications v dd = 3.0v, t a = +25c, r ext = 499k ? 1% tolerance. (continued) parameter description condition min (note 7) typ max (note 7) unit ir-led specifications t a = +25c parameter description condition min (note 7) typ max (note 7) unit v f ir-led forward voltage drop i f = 100ma 1.6 v i f = 200ma 1.8 v i r ir-led reverse-bias current v r = 5.5v 5 a p ir-led peak output wavelength i f = 100ma 855 nm ir-led spectral half-width i f = 100ma 30 nm e ir-led radiant power i f = 100ma 27 mw i ir-led radiant intensity (in 0.01sr) i f = 100ma 10 mw/sr i 2 c electrical specifications for scl and sda unless otherwise noted, v dd = 3v, t a = +25c, r ext = 499k ? 1% tolerance (note 11). parameter description condition min (note 7) typ max (note 7) unit v i 2 c supply voltage range for i 2 c interface 1.7 3.63 v f scl scl clock frequency 400 khz v il scl and sda input low voltage 0.55 v v ih scl and sda input high voltage 1.25 v v hys hysteresis of schmitt trigger input 0.05v dd v v ol low-level output voltage (open-drain) at 4ma sink current 0.4 v i i input leakage for each sda, scl pin -10 10 a t sp pulse width of spikes that must be suppressed by the input filter 50 ns t aa scl falling edge to sda output data valid 900 ns c i capacitance for each sda and scl pin 10 pf www.datasheet.net/ datasheet pdf - http://www..co.kr/
ISL29043 5 fn7935.0 february 9, 2012 t hd:sta hold time (repeated) start condition after this period, the first clock pulse is generated. 600 ns t low low period of the scl clock measured at the 30% of vdd crossing. 1300 ns t high high period of the scl clock 600 ns t su:sta set-up time for a repeated start condition 600 ns t hd:dat data hold time 30 ns t su:dat data set-up time 100 ns t r rise time of both sda and scl signals (note 12) 20 + 0.1xc b ns t f fall time of both sda and scl signals (note 12) 20 + 0.1xc b ns t su:sto set-up time for stop condition 600 ns t buf bus free time between a stop and start condition 1300 ns c b capacitive load for each bus line 400 pf r pull-up sda and scl system bus pull-up resistor maximum is determined by t r and t f 1k t vd;dat data valid time 0.9 s t vd:ack data valid acknowledge time 0.9 s v nl noise margin at the low level 0.1vdd v v nh noise margin at the high level 0.2vdd v notes: 11. all parameters in i 2 c electrical specifications table are guaranteed by design and simulation. 12. c b is the capacitance of the bus in pf. i 2 c electrical specifications for scl and sda unless otherwise noted, v dd = 3v, t a = +25c, r ext = 499k ? 1% tolerance (note 11). (continued) parameter description condition min (note 7) typ max (note 7) unit figure 3. i 2 c timing diagram www.datasheet.net/ datasheet pdf - http://www..co.kr/
ISL29043 6 fn7935.0 february 9, 2012 register map there are ten 8-bit regi sters accessible via i 2 c. registers 0x1 and 0x2 define the operation mode of the device. registers 0x3 through 0x7 store the various als/ir/prox thresholds, which trigger interrup t events. registers 0x8 through 0xa store the results of als/ir /prox adc conversions. table 1. ISL29043 regist ers and register bits addr reg name bit 7654321 0default 0x00 (n/a) (reserved) (n/a) 0x01 configure prox en prox_slp[2:0] prox_dr als_en als_range alsir_mode 0x00 0x02 interrupt prox_flag prox_prst[1:0] (write 0) als_flag als_prst[1:0] int_ctrl 0x00 0x03 prox_lt prox_lt[7:0] 0x00 0x04 prox_ht prox_ht[7:0] 0xff 0x05 alsir_th1 alsir_lt[7:0] 0x00 0x06 alsir_th2 alsir_ht[3:0] alsir_lt[11:8] 0xf0 0x07 alsir_th3 alsir_ht[11:4] 0xff 0x08 prox_data prox_data[7:0] 0x00 0x09 alsir_dt1 alsir_data[7:0] 0x00 0x0a alsir_dt2 (unused) alsir_data[11:8] 0x00 0x0e test1 (write as 0x00) 0x00 0x0f test2 (write as 0x00) 0x00 www.datasheet.net/ datasheet pdf - http://www..co.kr/
ISL29043 7 fn7935.0 february 9, 2012 register descriptions table 2. register 0x00 (reserved) bit # access default name function/operation 7:0 ro (n/a) (n/a) reserved - no need to read or write table 3. register 0x01 (configure) - prox/als configuration bit # access default name function/operation 7rw0x00 prox_en (prox enable) when = 0, proximity sensing is disabled when = 1, continuous proximity sensing is enable d. prox data will be ready 0.54ms after this bit is set high 6:4 rw 0x00 prox_slp (prox sleep) for bits 6:4 = (see the following) 111; sleep time between prox ir led pulses is 0.0ms (run continuously) 110; sleep time between prox ir led pulses is 12.5ms 101; sleep time between prox ir led pulses is 50ms 100; sleep time between prox ir led pulses is 75ms 011; sleep time between prox ir led pulses is 100ms 010; sleep time between prox ir led pulses is 200ms 001; sleep time between pr ox ir led pulses is 400ms 000; sleep time between prox ir led pulses is 800ms 3rw0x00 prox_dr (prox drive) when = 0, irdr behaves as a pulsed 110ma current sink when = 1, irdr behaves as a pulsed 220ma current sink 2rw0x00 als_en (als enable) when = 0, als/ir sensing is disabled when = 1, continuous als/ir sensing is enabled with new data ready every 100ms 1rw0x00 als_range (als range) when = 0, als is in low-lux range when = 1, als is in high-lux range 0rw0x00 alsir_mode (alsir mode) when = 0, als/ir data register contains visible als sensing data when = 1, als/ir data register contains ir spectrum sensing data table 4. register 0x02 (interrupt) - prox/als interrupt control bit # access default bit name function/operation 7flag0x00 prox_flag (prox flag) when = 0, no prox interrupt event has occurred since power-on or last ?clear? when = 1, a prox interrupt event occurred. clearable by writing ?0? 6:5 rw 0x00 prox_prst (prox persist) for bits 6:5 = (see the following) 00; set prox_flag if 1 conversion result trips the threshold value 01; set prox_flag if 4 conversion results trip the threshold value 10; set prox_flag if 8 conversion results trip the threshold value 11; set prox_flag if 16 conversion results trip the threshold value 4rw0x00 unused (write 0) unused register bit - write 0 3flag0x00 als_flag (als flag) when = 0, no als interrupt event has o ccurred since power-on or last ?clear? when = 1, an als interrupt event occurred. clearable by writing ?0? 2:1 rw 0x00 als_prst (als persist) for bits 2:1 = (see the following) 00; set als_flag if 1 conversion is outside the set window 01; set als_flag if 4 conversions are outside the set window 10; set als_flag if 8 conversions are outside the set window 11; set als_flag if 16 conver sions are outside the set window 0rw0x00 int_ctrl (interrupt control) when = 0, set int pin low if prox_flag or als_flag high (logical or) when = 1, set int pin low if prox_flag and als_flag high (logical and) table 5. register 0x03 (prox_lt) - interrupt low threshold for proximity sensor bit # access default bit name function/operation 7:0 rw 0x00 prox_lt (prox threshold) 8-bit interrupt low threshold for proximity sensing www.datasheet.net/ datasheet pdf - http://www..co.kr/
ISL29043 8 fn7935.0 february 9, 2012 table 6. register 0x04 (prox_ht) - interrupt high threshold for proximity sensor bit # access default bit name function/operation 7:0 rw 0xff prox_ht (prox threshold) 8-bit interrupt high threshold for proximity sensing table 7. register 0x05 (alsir_th1) - interrupt low threshold for als/ir bit # access default bit name function/operation 7:0 rw 0x00 alsir_lt[7:0] (als/ir low thr.) lower 8 bits (of 12 bits) for als/ir low interrupt threshold table 8. register 0x06 (alsir_th2) - interrupt low/high thresholds for als/ir bit # access default bit name function/operation 7:4 rw 0x0f alsir_ht[3:0] (als/ir high thr.) lower 4 bits (of 12 bits) for al s/ir high interrupt threshold 3:0 rw 0x00 alsir_lt[11:8] (als/ir low thr.) upper 4 bits (of 12 bits) for als/ir low interrupt threshold table 9. register 0x07 (alsir_th3) - interrupt high threshold for als/ir bit # access default bit name function/operation 7:0 rw 0xff alsir_ht[11:4] (als/ir high thr.) upper 8 bits (of 12 bits) for al s/ir high interrupt threshold table 10. register 0x08 (prox_data) - proximity sensor data bit # access default bit name function/operation 7:0 ro 0x00 prox_data (proximity data) results of 8-bit proximity sensor adc conversion table 11. register 0x09 (alsir_dt1) - als/ir sensor data (lower 8 bits) bit # access default bit name function/operation 7:0 ro 0x00 alsir_data (als/ir data) lower 8 bits (of 12 bits) from re sult of als/ir sensor conversion table 12. register 0x0a (alsir_dt2) - als/ir sensor data (upper 4 bits) bit # access default bit name function/operation 7:4 ro 0x00 ( unused ) unused bits. 3:0 ro 0x00 alsir_data (als/ir data) upper 4 bits (of 12 bits) from re sult of als/ir sensor conversion table 13. register 0x0e (test1) - test mode bit # access default bit name function/operation 7:0 rw 0x00 (write as 0x00) test mode register. when 0x00, in normal operation. table 14. register 0x0f (test2) - test mode 2 bit # access default bit name function/operation 7:0 rw 0x00 (write as 0x00) test mode register. when 0x00, in normal operation. www.datasheet.net/ datasheet pdf - http://www..co.kr/
ISL29043 9 fn7935.0 february 9, 2012 principles of operation i 2 c interface the ISL29043?s i 2 c interface slave address is internally hardwired as 0b100010, where ?0b? si gnifies binary notation and x represents the logic level on pin addr0. figure 4 shows a sample one-byte read. the i 2 c bus master always drives the scl (clock) line, while either the master or the slave can drive the sda (data) line. every i 2 c transaction begins with the master asserting a start condition (sda falling while scl remains high). the first transmitted byte is initiated by the master and includes 7 address bits and a r/w bit. the slave is responsible for pulling sda low during the ack bit after every transmitted byte. each i 2 c transaction ends with the master asserting a stop condition (sda rising wh ile scl remains high). for more information about the i 2 c standard, please consult the philips ? i 2 c specification documents. photodiodes and adcs the ISL29043 contains two phot odiode arrays which convert photons (light) into current. the als photodiodes are constructed to mimic the human eye?s wavelength response curve to visible light (see figure 11). the als photodiodes? current output is digitized by a 12-bit adc in 100ms. these 12 bits can be accessed by reading from i 2 c registers 0x9 and 0xa when the adc conversion is completed. the als converter is a charge-balancing integrating 12-bit adc. charge-balancing is best for conver ting small current signals in the presence of periodic ac noise. integrating over 100ms highly rejects both 50hz and 60hz light flicker by picking the lowest integer number of cycles for both 50hz/60hz frequencies. the proximity sensor is an 8-bit adc, which operates in a similar fashion. when proximity sensing is enabled, the irdr pin will drive the internal infrared led, the emitted ir reflects off an object (e.g., a human head) back into the ISL29043, and a sensor converts the reflected ir wave to a current signal in 0.54ms. the adc subtracts the ir reading before and after the led is driven (to remove ambient ir such as sunlight), and converts this value to a digital count stored in register 0x8. the ISL29043 is designed to run two conversions concurrently: a proximity conversion and an als (or ir) conversion. please note that because of the conversion times, th e user must let the adcs perform one full conversion first before reading from i 2 c registers prox_data (wait 0.54ms) or alsir_dt1/2 (wait 100ms). the timing between als and prox conversions is arbitrary (as shown in figure 5). the als runs continuously with ne w data available every 100ms. the proximity sensor runs continuously with a time between conversions decided by prox_slp (register 1 bits [6:4]). figure 4. i 2 c driver timing diagram for master and slave connected to common bus start w a a a6 a5 a4 a3 a2 a1 a0 w a r7 r6 r5 r4 r3 r2 r1 r0 a a6 a5 a4 a3 a2 a1 a0 w a aa ad7d6d5d4d3d2d1d0 1357 1357 123 45 6 9 2 4 6 stop start sda driven by master device address sda driven by ISL29043 data byte0 register address slave device address i 2 c data sda driven by master sda driven by master 2468 924689 78135789 i 2 c sda i 2 c sda i 2 c clk master (ISL29043) figure 5. timing diagram for prox/als events - not to scale als active 100ms 100ms 100ms prox sensor active irdr (current driver) als conversion time = 100ms (fixed) 0.54ms for prox conversion series of current pulses totaling 0.1ms sleep time (prox_slp) 100ms 100ms several s between conversions time time time www.datasheet.net/ datasheet pdf - http://www..co.kr/
ISL29043 10 fn7935.0 february 9, 2012 ambient light and ir sensing the ISL29043 is set for ambient li ght sensing when register bit alsir_mode = 0 and als_en = 1. the light-wavelength response of the als appears as shown in figure 11. als measuring mode (as opposed to ir measuring mode) is set by default. when the part is programmed for infrared (ir) sensing (alsir_mode = 1; als_en = 1), infrared light is converted into a current and digitized by the same als adc. the result of an ir conversion is strongly related to the amount of ir energy incident on our sensor, but is unitless and is referred to in digital counts. proximity sensing when proximity sensing is enabled (prox_en = 1), the internal ir led is driven for 0.1ms by the built-in ir led driver through the irdr pin. the amplitude of the ir led current depends on register 1 bit 3: prox_dr. if this bit is low, the load will see a fixed 110ma current pulse. if this bit is high, the load on irdr will see a fixed 220ma current pulse, as seen in figure 6. when the ir from the led reache s an object and gets reflected back into the ISL29043, the reflec ted ir light is converted into current as per the ir spectral re sponse shown in figure 11. one entire proximity measurement takes 0.54ms for one conversion (which includes 0.1ms spent dr iving the led), and the period between proximity measurements is decided by prox_slp (sleep time) in register 1 bits 6:4. average led driving current consumption is given by equation 1. a typical irdr scheme is 220m a amplitude pulses every 800ms, which yields 28 a dc. total current consumption total current consumption is the sum of i dd and i irdr . the irdr pin sinks current (as shown in fi gure 6) and the average irdr current can be calculated using equation 1. i dd depends on voltage and the mode-of-operation, as seen in figure 15. interrupt function the ISL29043 has an intelligent interrupt scheme designed to shift some logic processing away from intensive microcontroller i 2 c polling routines (which consume power) and towards a more independent light sensor, which can instruct a system to ?wake up? or ?go to sleep?. an als interrupt event (als_flag) is governed by registers 5 through 7. the user writes a high and low threshold value to these registers and the ISL29043 will issue an als interrupt flag if the actual count stored in registers 0x9 and 0xa are outside the user?s programmed window. the user must write 0 to clear the als_flag. a proximity interrupt event (prox_flag) is governed by the high and low thresholds in registers 3 and 4 (prox_lt and prox_ht). prox_flag is set when the measured proximity data is more than the higher threshold x-times-in-a-row (x is set by user; see next paragraph). the proximity interrupt flag is cleared when the prox data is lower than the low proximity threshold x-times-in-a-row, or when the user writes ?0? to prox_flag. interrupt persistency is another us eful option available for both als and proximity measurements. persistency requires x-in-a- row interrupt flags before the int pin is driven low. both als and prox have their own independent interrupt persistency options. see als_prst and prox_prst bits in register 2. the final interrupt option is the ability to and or or the two interrupt flags using register 2 bit 0 (int_ctrl). if the user wants both als/prox interrupts to happen at the same time before changing the state of the interrupt pin, set this bit high. if the user wants the interrupt pin to change state when either the als or the proximity interrupt flag goes high, leave this bit to its default of 0. als range 1 considerations when measuring als counts higher than 1800 on range 1 (alsir_mode = 0, als_range = 0, als_data > 1800), switch to range 2 (change the als_range bit from ?0? to ?1?) and re-measure als counts. this recommendation pertains only to applications where the light incide nt upon the sensor is ir-heavy and is distorted by tinted glass that increases the ratio of infrared to visible light. for more information, please contact the factory. v dd power-up and power supply considerations upon power-up, please ensure a v dd slew rate of 0.5v/ms or greater. after power-up, or if the user?s power supply temporarily deviates from our specification (2.25v to 3.63v), intersil recommends the user write the following: write 0x00 to register 0x01, write 0x29 to register 0x0f, write 0x00 to register 0x0e, and write 0x00 to register 0x0f. the user should then wait ~1ms or more and then rewrite all registers to the desired values. if the user prefers a hardware reset method instead of writing to test registers: set v dd =0v for 1 second or more, power back up at the required slew rate, and write registers to the desired values. power-down to put the ISL29043 into a power-do wn state, the user can set both prox_en and als_en bits to 0 in register 1. or more simply, set all of register 1 to 0x00. calculating lux the ISL29043?s adc output codes are directly proportional to lux when in als mode (s ee alsir_mode bit). figure 6. current drive mode options irdr 220ma (prox_dr = 1) (irdr is hi-z when not driving) 110ma (prox_dr = 0) led+ internal ir-led led- pcb trace i lrdr ave ; i lrdr peak ; 100 s t sleep ------------------------------------------------------- - = (eq. 1) e calc range out adc = (eq. 2) www.datasheet.net/ datasheet pdf - http://www..co.kr/
ISL29043 11 fn7935.0 february 9, 2012 in equation 2, e calc is the calculated lux reading and out represents the adc code. the constant to plug in is determined by the range bit als_range (register 0x1 bit 1) and is independent of the light source type. table 15 shows two different scale factors: one for the low range (als_range = 0) and the other for the high range (als_range = 1). noise rejection charge balancing adc?s have excellent noise-rejection characteristics for periodic nois e sources whose frequency is an integer multiple of the conversion rate. for instance, a 60hz ac unwanted signal?s sum from 0ms to k*16.66ms (k = 1,2...k i ) is zero. similarly, setting the device?s integration time to be an integer multiple of the periodic noise signal greatly improves the light sensor output signal in the presence of noise. since wall sockets may output at 60hz or 50hz, our integration time is 100ms: the lowest common integer number of cycles for both frequencies. proximity detection of various objects proximity sensing relies on the amount of ir reflected back from objects. a perfectly black object would absorb all light and reflect no photons. the ISL29043 is sensitive enough to detect black esd foam, which reflects only 1% of ir . for biological objects, blonde hair reflects more than brown hair and customers may notice that skin tissue is much more reflective than hair. ir penetrates into the skin and is reflected or scattered back from within. as a result, the proximity count peaks at cont act and monotonically decreases as skin moves away. the reflective characteristics of skin are very different from that of paper. typical opto-mechanical configuration typical applications for the ISL29043 involve use under a cover-glass, or optical window. typically, these glass components are not coated to prevent unwanted reflections. standard glass and many plastic materials will refl ect 4% of the incident light at each surface. reflected light emanating from the internal ir-led may be incident on the als/proximity sensor and cause significant dc-offset in the detected signals. to prevent this situation, the device sh ould be used with a light baffle, as shown in figure 7. a light baffle prevents unwanted illumination from the ir-led from reaching the als/proximity sensors while not interfering with normal ambien t light sensing or proximity detection. the baffle should be the limiting aperture for both the ir-led and the als/prox sensor. care should be taken to insure there is no other obstru ction in the light path. a light baffle is made from a soft, compliant plastic, or rubber material such as urethane, or s ilicone. the material should be mechanically compliant since a de signer desires it to fill the separation between the pcb and the cover-glass and should not produce undue stress on the thin cover-glass. a light baffle is designed to fit completely over the ISL29043 package and may be attached to the pcb with a dispensed adhesive. typical ISL29043 package height is 0. 65 mm (see ?package outline drawing? on page 16) and the inside lower cavity of the baffle is 0.4mm deep. with the cavity dept h less than the package height, the baffle does not reach fully to the pcb surface. this insures that the internal barrier rests squarely on the top surface of the package to prevent reflection of the ir-led illumination toward the sensor. the example light baffle in figure 7 is shown with a height of 1.1mm. however, the specific design-appropriate height varies according to actual system design requirements. if another material is chosen for a light baffle, the material should be soft and compliant and also should be matte black in finish to prevent reflection of the ir-led i llumination within a light baffle and surrounding structures underneath the cover-glass. suggested light baffle pcb footprint the light baffle fits down over the entire ISL29043 package. the lower wall thickness of the li ght baffle around the ISL29043 package is 0.3mm. therefore, the pcb layout should allow for a 0.3mm clear-zone immediately around the ISL29043 with no other surface components within this zone. operation without a light baffle for some product designs, it may be advantageous to use the ISL29043 under the cover-glass without a light baffle. for these applications, it is recommended that the opto-mechanical design place the top surface of the isl 29043 package in direct contact with the inside surface of the cover-glass. this configuration significantly reduces the ir-led illumination reflection from the inside surface of the cover-glass and reduces the dc-offset of the proximity sensor. for typical operational performance comparison, figure 8 shows a gr aph of the proximity response for a standard 18% kodak gray card target over a range of 0 to 100 mm for the same ISL29043 device with: a. no cover-glass, b. cover-glass (0.9 mm thick, ~7 5%t at 850nm) with light baffle, c. cover-glass (0.9 mm thick, ~75%t at 850nm) without light baffle and in contact with cover-glass, and, d. cover-glass (0.9 mm thick, ~75%t at 850nm) without light baffle and spaced 0.1 mm below cover-glass. also, it is highly recommended that only irdr = 110ma be used when operating the ISL29043 with out a a light baffle as the irdr = 220ma setting may cause a large dc-offset even with the ISL29043 placed in direct cont act with the inside surface of the cover glass. table 15. als sensitivity at different ranges als_range range (lux/count) 1 0.029 2 0.469 www.datasheet.net/ datasheet pdf - http://www..co.kr/
ISL29043 12 fn7935.0 february 9, 2012 typical circuit a typical application for the ISL29043 is shown in figure 9. the ISL29043?s i 2 c address is internally hardwired as 0b100010, with x representing the logic state of input i 2 c address pin addr0. the device can be tied onto a system?s i 2 c bus together with other i 2 c compliant devices. soldering considerations convection heating is recommended for reflow soldering; direct-infrared heating is not recommended. the plastic odfn package requires a custom reflow soldering profile pursuant to figure 4 in tb489 ( surface mount assembly guidelines for optical dual flat no lead (odfn) co-packages ). suggested pcb footprint it is important that users check the ?surface mount assembly guidelines for optical dual flat pack no lead (odfn) package? before starting odfn product board mounting. however, this device requires a special solder reflow profile as mentioned in figure 4 in tb489 (surface mount guidelines for optical co-packages ). http://www.intersil.com/data/tb/tb489.pdf layout considerations the ISL29043 is relatively insens itive to layout. like other i 2 c devices, it is intended to provide excellent performance even in significantly noisy environments. there are only a few considerations that will ensure best performance. route the supply and i 2 c traces as far as possible from all sources of noise. 0.1f and 1f power supply decoupling capacitors need to be placed close to the device. figure 7. example light baffle design figure 8. proximity comparison without light baffle (irdr = 110ma) 0 50 100 150 200 250 0 102030405060708090 distance (mm) no baffle, 0.1mm from glass against glass, no baffle no cover glass glass w/ baffle prox adc count www.datasheet.net/ datasheet pdf - http://www..co.kr/
ISL29043 13 fn7935.0 february 9, 2012 figure 9. ISL29043 typical circuit addr0 2 gnd 4 rext 5 sda int 8 irdr 9 ISL29043 r1 10k r2 10k rext 499k v dd microcontroller int sda slave_0 slave_1 i 2 c slave_n i 2 c master scl sda scl sda v i2c pull-up 7 r3 10k scl 3 v dd 6 c3 0.1f scl c2 1f 10 1 led+ led- v led c1 1.0f typical performance curves v dd = 3.0v, r ext = 499k ? . figure 10. spectrum of four light sources normalized by luminous intensity (lux) figure 11. ISL29043 sensitivity to different wavelengths figure 12. angular sensitivit y figure 13. als linearity over 2 light sources (2000 lux range) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 350 550 750 950 wavelength (nm) normalized intensity fluorescent sun incand. halogen 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 300 400 500 600 700 800 900 1000 1100 wavelength (nm) normalized response als human eye ir/prox 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -90 -60 -30 0 30 60 90 angle () normalized sensitivity 0 500 1000 1500 2000 2500 3000 3500 4000 4500 0 500 1000 1500 2000 lux meter reading (lx) fluorescent halogen incandescent als code (1-2 bit) www.datasheet.net/ datasheet pdf - http://www..co.kr/
ISL29043 14 fn7935.0 february 9, 2012 figure 14. prox counts vs distance with 10cmx10cm reflectors figure 15. v dd vs i dd for various modes of operation figure 16. irdr pulse amplitude vs v irdr figure 17. stability of als count over temp (at 325 lux) figure 18. ir-led lateral em ission pattern (normalized intensity vs lat ) figure 19. ir-led transverse emission pattern (normalized intensity vs trans ) typical performance curves v dd = 3.0v, r ext = 499k ? . (continued) 0 51 102 153 204 255 0 25 50 75 100 125 150 distance (mm) prox counts (8-bit) 220ma (18% grey card) 110ma (18% grey card) 110ma (white copy paper) 220ma (white copy paper) 40 100 120 140 160 2.25 2.40 2.55 2.85 3.00 3.15 3.45 input v dd (v) measured i dd (a) 3.60 3.30 2.70 60 80 als+prox (during prox sleep) als-only prox (during prox sleep) 100 120 140 160 180 200 220 240 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 220ma-mode (prox_dr = 1) 110ma-mode (prox_dr = 0) v irdr (v) i irdr (ma) -10 -8 -6 -4 -2 0 2 4 6 8 10 -40 -20 0 20 40 60 80 temperature (c) als output change from +25c (%) " www.datasheet.net/ datasheet pdf - http://www..co.kr/
ISL29043 15 intersil products are manufactured, assembled and tested utilizing iso9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality intersil products are sold by description only. intersil corporat ion reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnished by intersil is believed to be accurate and reliable. however, no responsi bility is assumed by intersil or its subsid iaries for its use; nor for any infringem ents of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of i ntersil or its subsidiaries. for information regarding intersil corporation and its products, see www.intersil.com fn7935.0 february 9, 2012 for additional products, see www.intersil.com/product_tree products intersil corporation is a leader in the design and manufacture of high-performance analog semico nductors. the company's product s address some of the industry's fastest growing markets, such as , flat panel displays, cell phones, handheld products, and noteb ooks. intersil's product families address power management and analog sign al processing functions. go to www.intersil.com/products for a complete list of intersil product families. for a complete listing of applications, rela ted documentation and related parts, please see the respective device information p age on intersil.com: ISL29043 to report errors or suggestions for this datasheet, please go to: www.intersil.com/askourstaff fits are available from our website at: http://rel.intersil.com/reports/sear figure 20. definition of lateral and transverse axes typical performance curves v dd = 3.0v, r ext = 499k ? . (continued) lateral transverse revision history the revision history provided is for inform ational purposes only and is believed to be accurate, but not warranted. please go t o web to make sure you have the latest rev. date revision change february 9, 2012 fn7935.0 initial release. www.datasheet.net/ datasheet pdf - http://www..co.kr/
ISL29043 16 fn7935.0 february 9, 2012 package outline drawing l10.2.1x3.5e 10 lead optical co-package rev 2, 1/12 bottom view detail "x" side view typical recommended land pattern top view side view non-symmetry of the package created by the 2 omitted pads. unless otherwise specified, tolerance: decimal 0.05 tiebar shown (if present) is a non-functional feature. the configuration of the pin #1 identifier is guaranteed by the between 0.015mm and 0.30mm from the terminal tip. dimension applies to the metallized terminal and is measured dimensions in ( ) for reference only. dimensioning and tolerancing c onform to asme y14.5m-1994. 6. 3. 5. 4. 2. dimensions are in millimeters. 1. notes: b 0.10 m a c c seating plane base plane 0.08 0.10 see detail "x" c c 0 . 00 min. 0 . 05 max. 0 . 2 ref c 5 package 0.20 (0.20) (0.17) 0.68 0.065 1.00 0.50 0.25 1.00 0.50 5 6 10 pin # 1 2.49 0.20 0.44 0.81 0.20 0.37 0.37 0.63 0.37 0.86 0.44 0.37 0.15 0.37 outline 4 (4x) 0.10 index area pin 1 6 a b 2.10 3.50 (0.39) 29030 isl29028 1.24 0.90 0.36 0.36 0.49 0.41 0.03 0.63 www.datasheet.net/ datasheet pdf - http://www..co.kr/


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